Xpeng unveils new modular EV architecture

The Chinese carmaker Xpeng has presented its next-generation EV architecture called ‘Smart Electric Platform Architecture’, or SEPA 2.0. The G6 electric SUV will be the first model based on the new platform.

According to Xpeng, The SEPA 2.0 is adaptable “for wheelbases between 1,800mm and 3,200mm and scalable to support a variety of vehicle types, including sedan, coupe, hatchback, wagon, SUV, MPV and pickup truck.” It is also modular and said to shorten future EV models’ research and development cycles by 20 per cent. Moreover, it allows for more than 80 per cent of interchangeability of common architectural components between future models. That way, the carmaker can “meet diverse customer needs,” all while cutting costs.

“We envision that this evolutionary intelligent architecture will lead smart EV technology development for the next three years,” says Xpeng Chairman and CEO He Xiaopneg. “It will make rapid advancements in technology available for our customers as standard, with faster software upgrades, stunning cost savings and elevated product experience.”

For example, SEPA 2.0 is expected to increase the R&D cost efficiency of Xpeng’s XNGP Advanced Driver Assistance System (ADAS) (which will come standard in all future models) by 30 per cent, while cutting ADAS software model adaption costs by as much as 70 per cent. And the company’s 800 Volt High Voltage Silicon Carbide (SiC) platform enables end-to-end 800V high voltage charging, increasing battery charging speeds by 50 per cent compared to the previous generation. According to the EV maker, “the battery can add 130 kilometres of range with a five-minute charge, and can charge even faster at XPENG’s S4 480kW superfast charging facilities, adding 200 km of range with a five-minute charge.”

In terms of manufacturing, front and rear integrated aluminium die casting technology “enables more uniform fabrication of the car body, improving “torsional rigidity by 83 per cent compared to a traditional car body, enhancing safety, while reducing body weight by 17 per cent versus traditional bodies, further boosting EV range.” Moreover, the CIB (Cell Integrated Body) technology optimizes cabin design with added vertical space, increases battery safety, and enhances driving performance by improving the centre of gravity. And the chassis platform is compatible with “multiple types of suspension systems, providing superior mechanical quality and excellent handling performance.”

Xpeng is said to unveil the G6, the first EV to use the SEPA 2.0, at the Shanghai Auto Show this week.

businesswire.com

0 Comments

about „Xpeng unveils new modular EV architecture“

Leave a Reply

Your email address will not be published. Required fields are marked *