VW and Xpeng sign deal on E/E architecture

VW and Xpeng have signed a framework agreement on technical cooperation for the Electrical/Electronic architecture ("E/E Architecture"). It will be integrated into VW's China-specific EV platform CMP.

Image: Xpeng

As reported, at least four entry-level models will be based on the so-called China Main Platform from 2026. However, despite the same abbreviation, the China Main Platform should not be confused with the Common Modular Platform and the electric offshoot e-CMP from Stellantis or the CMP Smart Car version for the Citroen e-C3 and Opel Frontera, and others.

Volkswagen and Xpeng have been officially working together since February. At the time, VW also published the first teaser image of the jointly-developed electric SUV. The German carmaker also invested 700 million dollars in its new Chinese partner. VW will launch two electric mid-range models in 2026, developed jointly with Xpeng as part of that agreement. The four electric models for the entry-level segment based on the China Main Platform are an internal VW project; the two mid-range models from VW based on Xpeng developments are independent of this.

VW has yet to publish any further details on the China Main Platform – there has already been speculation that the new electric Volkswagens for China could be based on an MEB version optimised with Xpeng technology. It is now clear from the announcement that the E/E architecture of the CMP will be an in-house development by Xpeng, which will form the basis for the “vertically integrated full-stack software and hardware technologies,” according to the Chinese. “It allows software including ADAS and Connectivity OS to decouple from the underlying hardware and vehicle platforms, achieving fast iteration of software across platforms.”

Xpeng says the latest generation of its E/E architecture uses a centralised computing and domain controller-based architecture. “It allows software, including ADAS and Connectivity OS, to decouple from the underlying hardware and vehicle platforms, achieving fast iteration of software across platforms. Data transmission will be in the gigabit range, and a “significant number of electronic control units have been integrated into the domain controllers, leading to highly integrated architecture and competitive cost structure.”

“The shared passion for technology and innovation brought Xpeng and Volkswagen together. Both parties continue to contribute each other’s best to our strategic partnership,” says Xiaopeng He, Chairman and CEO of Xpeng. “The technical collaboration based on our industry-leading E/E Architecture takes our partnership to the next level and on a much larger scale. The collaboration will allow our Smart EV products to be both technologically competitive and cost competitive.”

Ralf Brandstätter, Member of the Board of Management of Volkswagen AG for China, comments: “Both partners bring their strengths to the table. This increases efficiency, optimises cost structures and accelerates the speed of development. High cost-effectiveness and a fast pace of development are crucial for our competitiveness in China’s dynamic market environment. Through such efforts, we are taking on a leading role in the age of intelligent connected vehicles.”



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