Infineon introduces more efficient chip generation
High-voltage IGBTs (insulated gate bipolar transistors) are essential components in electric cars. They convert the DC voltage from the battery into AC voltage for the electric drive efficiently and with low energy loss. RC-IGBTs (Reverse Conducting IGBTs) combine the transistor with a freewheeling diode on a chip. This saves space, reduces switching losses and improves cooling. EDT3 chips (3rd generation electric drive train), on the other hand, represent the latest generation of chips for electric drive trains. They integrate modern sensor technology for temperature and current monitoring and ensure higher efficiency, greater range and lower energy consumption.
Compared to the previous EDT2 generation, Infineon has been able to reduce energy losses in the EDT3 chips by up to 20 per cent under high load, while maintaining the same efficiency in partial load operation. This means: less energy loss, less waste heat, better range and lower costs for electric vehicles. Thanks to higher maximum temperatures (up to 185°C) and a robust dielectric strength (750 or 1,200 V), they are ideal for main inverters.
The new generation of chips from Infineon to make electric cars more powerful
Infineon is launching a new generation of high-voltage power chips to make electric cars and plug-in hybrids more efficient and powerful. These include the EDT3 chips and RC-IGBT chips.
The new RC-IGBTs with a voltage class of 1,200 V also combine IGBT and diode on one chip – this increases the current density, reduces material requirements and saves costs during system integration. They are particularly suitable for modern 800-volt architectures, such as those used in high-performance electric cars.
Leadrive, a Chinese developer and manufacturer of silicon carbide power modules, in which Volvo Cars has a stake, is positive about the new chips. “Infineon, as Leadrive’s primary IGBT chip supplier and partner, consistently provides us with innovative solutions that deliver system-level benefits,” said Dr Jie Shen, founder and General Manager of Leadrive. “The latest EDT3 chips have optimized losses and loss distribution, support higher operating temperatures, and offer multiple metallization options. These features not only reduce the silicon area per ampere, but also accelerate the adoption of advanced packaging technologies.”
All chips can be integrated into customised power modules, such as the new HybridPACK Drive G2, which covers up to 250 kW of power. The new EDT3 and RC-IGBT components are now available as samples for the automotive industry.
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